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Additional info for 4M 2006 - Second International Conference on Multi-Material Micro Manufacture
Gelin An Ultrathick SU-8 UV Lithographic Process and Sidewall Characterization K. Jiang, C-H. Lee and P. T. Docker, J. D. C. 4TiO3 (BST60) Thick-Films on Alumina-Substrates F. R. Binder, A. Berto, G. Link and H-J. Ritzhaupt-Kleissl 221 Self-Assembled Nanostructured Polymer Films From Concentrated Solutions of Block Copolymers N. Didier and P. Panine 231 Process Modelling and Simulation Mechanistic Modelling of the Micro- End Milling Operation L. Uriarte, S. Azcarate, A. N. Lopez de Lacalle and A.
Buschbeck, A. Chalupka, G. Lammer, E. Platzgummer, H. H. De Jager, R. Kaesmaier, A. Ehrmann, S. Hirscher, A. Wolter, A. Dietzel, R. Berger, H. D. H. Bruenger, D. Adam, M. Boehm, H. Eichhorn, R. Springer, J. Butschke, F. Letzkus, P. C. A. 6, 594-608. H. Bruenger et al. Appl Phys. Lett. 1999, 15, 403.  TRIM computer simulation software, Biersack GbR,Bergstr. org  A. Dietzel, R. Berger, H. H. Brunger, C. Dzionk, F. Letzkus, R. Springer, H. Loeschner, E. Platzgummer, G. Z. D. Terris, IEEE Trans.
Berger, H. Loeschner, G. H. Bruenger, F. Letzkus, Adv. Mater. 2003, 15, 11521155. A. H. Bruenger, C. Dzionk, P. Schmucki, J. Vac. Sci. Technol. B 2002, 65, 153161. Fig. 6. Electron microscopy image (from ) of Cu structures electroplated on a p-Si(100) surface which was locally sensitized ion projection. The Cu structures resolved are in the order of 200 nm. 7. Conclusion and Outlook Ion projection techniques are capable of producing nanostructures down at least to 50 nm in resist. They can be seen as an alternative to highly advanced optical or e-beam lithography.