4M 2006 - Second International Conference on Multi-Material by Stefan Dimov, Wolfgang Menz, Bertrand Fillon

By Stefan Dimov, Wolfgang Menz, Bertrand Fillon

This paintings covers the newest state of the art study effects from best ecu researchers in complex micro applied sciences for batch processing of metals, polymers, and ceramics, and the advance of recent construction structures for micro systems-based products.These contributions are from best authors at a platform recommended and funded by means of the ecu Union R&D neighborhood, in addition to top universities, and self sufficient examine and company companies. This finished selection of listed and peer reviewed articles includes a CD with seek performance. * comprises authoritative papers that mirror the newest advancements in micro applied sciences and micro systems-based items* contains a uncomplicated CD Rom with seek performance

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Gelin An Ultrathick SU-8 UV Lithographic Process and Sidewall Characterization K. Jiang, C-H. Lee and P. T. Docker, J. D. C. 4TiO3 (BST60) Thick-Films on Alumina-Substrates F. R. Binder, A. Berto, G. Link and H-J. Ritzhaupt-Kleissl 221 Self-Assembled Nanostructured Polymer Films From Concentrated Solutions of Block Copolymers N. Didier and P. Panine 231 Process Modelling and Simulation Mechanistic Modelling of the Micro- End Milling Operation L. Uriarte, S. Azcarate, A. N. Lopez de Lacalle and A.

Buschbeck, A. Chalupka, G. Lammer, E. Platzgummer, H. H. De Jager, R. Kaesmaier, A. Ehrmann, S. Hirscher, A. Wolter, A. Dietzel, R. Berger, H. D. H. Bruenger, D. Adam, M. Boehm, H. Eichhorn, R. Springer, J. Butschke, F. Letzkus, P. C. A. 6, 594-608. H. Bruenger et al. Appl Phys. Lett. 1999, 15, 403. [5] TRIM computer simulation software, Biersack GbR,Bergstr. org [6] A. Dietzel, R. Berger, H. H. Brunger, C. Dzionk, F. Letzkus, R. Springer, H. Loeschner, E. Platzgummer, G. Z. D. Terris, IEEE Trans.

Berger, H. Loeschner, G. H. Bruenger, F. Letzkus, Adv. Mater. 2003, 15, 11521155. [10]A. H. Bruenger, C. Dzionk, P. Schmucki, J. Vac. Sci. Technol. B 2002, 65, 153161. Fig. 6. Electron microscopy image (from [10]) of Cu structures electroplated on a p-Si(100) surface which was locally sensitized ion projection. The Cu structures resolved are in the order of 200 nm. 7. Conclusion and Outlook Ion projection techniques are capable of producing nanostructures down at least to 50 nm in resist. They can be seen as an alternative to highly advanced optical or e-beam lithography.

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